Wire Bonding

Wire_bondingWire bonding is used to electrically interconnect an integrated circuit, or any other semiconductor device, to a compatible metallic surface. A length of small diameter soft metal wire is used to make the link and the bond is created by applying force and ultrasonic vibration.


Chip-on-board wire bonding is a core part of Corintech’s assembly capabilities with gold wire bonding and aluminium wire bonding machines available on-site. Finished circuits are protected with epoxy encapsulation. The wire bonding process is extremely precise and delicate – the diameter of the wire can measure as little as 15µm which requires threading through a hole invisible to the naked eye.


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