Thick Film Circuit Boards
Corintech has been a leading specialist in the design and manufacture of Thick Film circuit board microelectronic assemblies since 1977.
Thick Film Hybrids are ideal for environments where a high level of reliability is needed as they can withstand a much wider temperature range and have higher durability than conventional PCB assemblies.
Thick Film technology is usually used in aerospace, defence and automotive applications, however its durable and reliable nature are starting to appeal to a broader market. As a well experience company in this ever-increasing technology, we are the perfect partner to develop and manufacture Thick Film circuit boards to suit any application.
Thick Film Hybrid circuits are made using a print & fire (P+F) technique. This involves a combination of multi-layer screen printing of precious and semi-precious metals (Au, Ag, Pd) as well as the firing of tracks and precision resistors onto a range of ceramic and metal substrates. Surface mount components and bare die components with wire bonding can also be incorporated, and optional full encapsulation provides greater protection from wearing.
Our skilled team of engineers can assist you in determining the potential of utilising Thick Film technology within your designs.
Here are just a few benefits offered by Thick Film Hybrid Circuits:
- High reliability for harsh environment applications
- Flexibility to choose precise resistor values with active laser trimming
- High Voltage (HV) resistors
- Extended temperature range performance
- Improved thermal management with thermally conductive substrates
- Excellent high-frequency performance
- Low start-up costs and fast lead-time to prototype
Call us now on +44 (0)1425 655655. Our experienced team are on hand to discuss your requirements and provide expert advice.