Wire bonding is used to electrically interconnect an integrated circuit, or any other semiconductor device, to a compatible metallic surface. A length of small diameter soft metal wire is used to make the link, and the bond is created by applying force and ultrasonic vibration. Finished circuits are protected with epoxy encapsulation.
Chip-on-board wire bonding is a core part of Corintech’s assembly capabilities, with gold and aluminium wire bonding machines available on-site in the UK.
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