Wire bonding is used to electrically interconnect an integrated circuit, or any other semiconductor device, to a compatible metallic surface. A length of small-diameter, soft metal wire is used to make the link, and the bond is created by applying force and ultrasonic vibration. Finished circuits are normally protected with epoxy encapsulation.
Chip-on-board wire bonding is a core part of Corintech’s assembly capabilities, with gold and aluminium wire bonding machines available on-site in the UK and the Far East. These give us the capability to work with wire diameters as low as 15 microns for aluminium wire and 25 microns for gold wire.
Our UK site houses two powerful pieces of wire bonding machinery:
- ASM AB350 Automatic Wire Bonder
- K&S 1419 Gold Automatic Wire Bonder
These allow us to be extremely flexible to our customers’ needs, offering aluminium or gold wire bonding options, as well as a range of bonding techniques (including ball and wedge) to maximise their product efficiency.
Using our ASM Automatic Wire Ball Bonder, we are able to provide ball bonding solutions for a variety of substrates. Ball bonding techniques allow for the production of more complex wire loops, potentially improving your design efficiency. This machinery’s advanced features and intelligent interface facilitates precision fine pitch bonding with rapid turnaround.
- Higher numbers of inputs and outputs
- Reduced costs from smaller size (less materials required)
- Smaller and lighter final product
- Increased wafer output
- Potentially improved electrical performance
Contact our team today if you want to discuss potential wire bonding enhancements for your product design, or you want your electronics manufacturing carried out to a higher level of quality.
Call us now on +44 (0)1425 655655. Our experienced team are on hand to discuss your requirements and provide expert advice.
Latest News from Corintech
Corintech and Sister Company Lascar Electronics Open New 15,000 sqft Warehouse in Hong Kong.
Corintech Ltd and Lascar Electronics, two global electronics companies, are pleased to announce the official opening of their new Far East warehouse in Hong Kong. Colleagues from all departments visited the warehouse in the first week of June for the opening ceremony to witness Dean James, Managing Director at Corintech (HK) Ltd & Lascar Electronics, cut the ribbon on the 15,000 sqft facility.
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