Wire Bonding

Wire bonding is used to electrically interconnect an integrated circuit, or any other semiconductor device, to a compatible metallic surface. A length of small-diameter, soft metal wire is used to make the link, and the bond is created by applying force and ultrasonic vibration. Finished circuits are normally protected with epoxy encapsulation.

Chip-on-board wire bonding is a core part of Corintech’s assembly capabilities, with gold and aluminium wire bonding machines available in the Far East. These give us the capability to work with wire diameters as low as 15 microns for aluminium wire and 25 microns for gold wire.

Ball Bonding

Using our ASM Automatic Wire Ball Bonder, we are able to provide ball bonding solutions for a variety of substrates. Ball bonding techniques allow for the production of more complex wire loops, potentially improving your design efficiency. This machinery’s advanced features and intelligent interface facilitates precision fine pitch bonding with rapid turnaround.

• Higher numbers of inputs and outputs
• Reduced costs from smaller size (less materials required)
• Smaller and lighter final product
• Increased wafer output
• Potentially improved electrical performance

Contact our team today if you want to discuss potential wire bonding enhancements for your product design, or you want your electronics manufacturing carried out to a higher level of quality.