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Wire Bonding

Wire bonding is used to electrically interconnect an integrated circuit, or any other semiconductor device, to a compatible metallic surface. A length of small-diameter, soft metal wire is used to make the link, and the bond is created by applying force and ultrasonic vibration. Finished circuits are normally protected with epoxy encapsulation.

Chip-on-board wire bonding is a core part of Corintech’s assembly capabilities, with gold and aluminium wire bonding machines available on-site in the UK and the Far East. These give us the capability to work with wire diameters as low as 15 microns for aluminium wire and 25 microns for gold wire.

Cutting-Edge Machinery

Our UK site houses two powerful pieces of wire bonding machinery:

  • ASM AB350 Automatic Wire Bonder
  • K&S 1419 Gold Automatic Wire Bonder

These allow us to be extremely flexible to our customers’ needs, offering aluminium or gold wire bonding options, as well as a range of bonding techniques (including ball and wedge) to maximise their product efficiency.

Ball Bonding

Using our ASM Automatic Wire Ball Bonder, we are able to provide ball bonding solutions for a variety of substrates. Ball bonding techniques allow for the production of more complex wire loops, potentially improving your design efficiency. This machinery’s advanced features and intelligent interface facilitates precision fine pitch bonding with rapid turnaround.

  • Higher numbers of inputs and outputs
  • Reduced costs from smaller size (less materials required)
  • Smaller and lighter final product
  • Increased wafer output
  • Potentially improved electrical performance

Contact our team today if you want to discuss potential wire bonding enhancements for your product design, or you want your electronics manufacturing carried out to a higher level of quality.

Contact Us

Call us now on +44 (0)1425 655655. Our experienced team are on hand to discuss your requirements and provide expert advice.

Latest News from Corintech

The Risk of Counterfeit Components to Electronics Supply Chains in 2021

During times when the supply chain is under considerable strain, the risk of encountering counterfeit components rises. Counterfeit components are more common than you think, and pose a serious threat to electronics supply chains. Counterfeits often fail to meet the required performance demands of businesses, resulting in final products performing intermittently, not to spec, or not at all. Fake components can degrade system performance, cause intermittent performance spikes or delays, and limit the performance of other components in the system. This ultimately leads to product malfunction, which in the case of certain devices such as medical equipment, could be fatal.