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Wire Bonding

Wire bonding is used to electrically interconnect an integrated circuit, or any other semiconductor device, to a compatible metallic surface. A length of small diameter soft metal wire is used to make the link, and the bond is created by applying force and ultrasonic vibration. Finished circuits are protected with epoxy encapsulation.

Chip-on-board wire bonding is a core part of Corintech’s assembly capabilities, with gold and aluminium wire bonding machines available on-site in the UK. 

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Call us now on +44 (0)1425 655655. Our experienced team are on hand to discuss your requirements and provide expert advice.

Latest News from Corintech

Corintech Announce Exhibition For Northern Manufacturing & Electronics Show 2019

The Northern Manufacturing & Electronics Show was inaugurated in 2013 and has quickly established itself as a popular marketplace for technological engineering. Corintech’s electronics experts will be on hand to discuss how its specialisms in custom electronics design and manufacturing can optimise your business’ production capacity.

Corintech Is Exhibiting At The 2019 Engineering Design Show

Corintech will once again return to the UK’s biggest design event in October 2019. With their experts on-hand to offer advanced electronics design and manufacturing solutions.