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Wire Bonding

Wire bonding is used to electrically interconnect an integrated circuit, or any other semiconductor device, to a compatible metallic surface. A length of small diameter soft metal wire is used to make the link, and the bond is created by applying force and ultrasonic vibration. Finished circuits are protected with epoxy encapsulation.

Chip-on-board wire bonding is a core part of Corintech’s assembly capabilities, with gold and aluminium wire bonding machines available on-site in the UK. 

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Call us now on +44 (0)1425 655655. Our experienced team are on hand to discuss your requirements and provide expert advice.

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Corintech Set To Appear At Fordingbridge Festival

On Saturday 20th July, Corintech will have a stall at Fordingbridge Festival 2019. Corintech's electronics experts will be on hand with fun games, product examples and recruitment opportunities, hoping to enjoy the festivities and entertainment with the local community...

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