Thick Film Hybrids


Corintech is a leading specialist in the design and manufacture of thick film hybrid microelectronic assemblies – it’s where our origins lie.


Thick film technology is ideally suited for applications in hostile environments where a higher, more robust level of reliability is required. They have a much wider temperature range than conventional PCB assemblies due to the thermal properties of the substrates used. Full encapsulation also provides tolerance to moisture, corrosion and vibration meaning greater reliability over time.


Contact Us                 Hybrid Specifications

Contact us today for a quotation or to discuss how best to manufacture your product for market.