Microelectronics

• Thick Film Hybrids.
• Opto Electronics - LED.
• Circuits on T--Clad or Steel.
• High Temperature Circuits.
• High Power Circuits.
• RoHS compliance, leaded capability fully retained for client choice.
• Chip on Board wire bonding.
• Multichip Modules, Laminate and Ceramic MCM - L & C.
• Chip Scale Packaging.
• Sensors on ceramic or steel.
• Full functional test as mutually agreed.
• Heat Soak, Burn In and Temperature Cycling.

For full technical specifications please contact Corintech on + 44 (0) 1425 655 655